Embedded microstrip structures of on-chip and MCM-Si interconnection lines for Giga-Hertz digital signal Transmission
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joung-Ho | ko |
| dc.date.accessioned | 2013-03-02T13:45:08Z | - |
| dc.date.available | 2013-03-02T13:45:08Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2000-08 | - |
| dc.identifier.citation | IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.0, no.0, pp.0 - 0 | - |
| dc.identifier.issn | 1521-3323 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/73803 | - |
| dc.language | English | - |
| dc.publisher | Institute of Electrical and Electronics Engineers | - |
| dc.title | Embedded microstrip structures of on-chip and MCM-Si interconnection lines for Giga-Hertz digital signal Transmission | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 0 | - |
| dc.citation.issue | 0 | - |
| dc.citation.beginningpage | 0 | - |
| dc.citation.endingpage | 0 | - |
| dc.citation.publicationname | IEEE TRANSACTIONS ON ADVANCED PACKAGING | - |
| dc.contributor.localauthor | Kim, Joung-Ho | - |
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