A Study on the Eutectic Pb/Sn Solder Flip Chip Bump and Its Under Bump Metallurgy (UBM)

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In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1m Al/0.2m Pd/1m Cu, laid under eutectic Pb/Sn solder were investigated with regard to their interfacial reactions and adhesion proper-ties. The effects of numbers of solder reflow and aging time on the growth of intermetallic compounds (IMCs) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1m Al/0.2m Ti/5m Cu and 1m Al/0.2m ni/1m Cu even after 4 solder reflows or 7 day aging at 15. In contrast 1m Al/0.2m Ti/1m Cu and 1mAl/0.2m Pd/1m 쳐 show poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and nonwettable metal such as Ti and Al resulting in a delamination. In this case thin 1m Cu and 0.2m Pd diffusion barrier layer were completely consumed by Cu-Sn and pd-Sn reaction.
한국마이크로전자 및 패키징학회
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한국마이크로전자 및 패키징학회지, v.5, no.1, pp.7 - 18

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MS-Journal Papers(저널논문)
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