HgCdTe 하이브리드 칩을 위한 인듐범프와 UBM에 관한 연구Study of Indium Bumps and UBM for HgCdTe Hybrid Chips
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Hee-Chul | ko |
| dc.contributor.author | Lee, Sang-Jun | ko |
| dc.contributor.author | Choi, Jong-Hwa | ko |
| dc.contributor.author | Bae, Soo-Ho | ko |
| dc.date.accessioned | 2013-03-02T12:22:40Z | - |
| dc.date.available | 2013-03-02T12:22:40Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2000-10 | - |
| dc.identifier.citation | 새물리, v.41, no.4, pp.239 - 242 | - |
| dc.identifier.issn | 0374-4914 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/73503 | - |
| dc.language | Korean | - |
| dc.publisher | 한국물리학회 | - |
| dc.title | HgCdTe 하이브리드 칩을 위한 인듐범프와 UBM에 관한 연구 | - |
| dc.title.alternative | Study of Indium Bumps and UBM for HgCdTe Hybrid Chips | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 41 | - |
| dc.citation.issue | 4 | - |
| dc.citation.beginningpage | 239 | - |
| dc.citation.endingpage | 242 | - |
| dc.citation.publicationname | 새물리 | - |
| dc.contributor.localauthor | Lee, Hee-Chul | - |
| dc.contributor.nonIdAuthor | Lee, Sang-Jun | - |
| dc.contributor.nonIdAuthor | Choi, Jong-Hwa | - |
| dc.contributor.nonIdAuthor | Bae, Soo-Ho | - |
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