Simulation of solderless pin connection using frictional contact mechanics with displacement input변위 입력 주도형 마찰 접촉 수식화에 의한 비납땜형 커넥터의 해석
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hwang, Gunn | ko |
| dc.contributor.author | Kwak, Byung Man | ko |
| dc.date.accessioned | 2013-02-27T23:27:43Z | - |
| dc.date.available | 2013-02-27T23:27:43Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-08 | - |
| dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGY - PART B, v.0, no.0, pp.0 - 0 | - |
| dc.identifier.issn | 1070-9894 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/71479 | - |
| dc.language | English | - |
| dc.publisher | IEEE-Inst Electrical Electronics Engineers Inc | - |
| dc.title | Simulation of solderless pin connection using frictional contact mechanics with displacement input | - |
| dc.title.alternative | 변위 입력 주도형 마찰 접촉 수식화에 의한 비납땜형 커넥터의 해석 | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 0 | - |
| dc.citation.issue | 0 | - |
| dc.citation.beginningpage | 0 | - |
| dc.citation.endingpage | 0 | - |
| dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGY - PART B | - |
| dc.contributor.localauthor | Kwak, Byung Man | - |
| dc.contributor.nonIdAuthor | Hwang, Gunn | - |
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