수직 웨이퍼상의 입자 침착 속도의 측정Measurement of Particle Deposition Velocity Toward a Vertical Wafer Surface

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The average particle deposition velocity toward a vertical wafer surface in a vertical airflow chamber was measured by a wafer surface scanner(PMS Model SAS-3600). Polystyrene latex(PSL) spheres with diameters between 0.3 and 0.8㎛ were used. To examine the effect of the airflow velocity on the deposition velocity, experiments were conducted for three vertical airflow velocities ; 20, 30, 50cm/s. Experimental data of particle deposition velocity were compared with those given by prediction model suggested by Liu and Ahn(1987).
Publisher
대한설비공학회
Issue Date
1995-08
Language
Korean
Citation

설비공학논문집, v.7, no.3, pp.521 - 527

ISSN
1229-6422
URI
http://hdl.handle.net/10203/70321
Appears in Collection
AE-Journal Papers(저널논문)
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