Showing results 1 to 4 of 4
Filling of very fine via holes for three-dimensional packaging by using ionized metal plasma sputtering and electroplating Cho, Byeong-Hoon; Yun, Jae-Jin; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.46, no.45-49, pp.L1135 - L1137, 2007-12 |
IMP-PVD system을 이용하여 증착한 via hole 내부의 Cu 박막 형상에 관한 연구 = Study on profile of Cu thin films deposited by IMP-PVD system inside via holeslink 윤재진; Yun, Jae-Jin; et al, 한국과학기술원, 2006 |
Phase Change Characteristics of InxSb40-xTe60 Chalcogenide Alloy for Phase Change Random Access Memory Yun, Jae-Jin; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.50, no.7, pp.071201-1 - 071201-8, 2011-07 |
상변화메모리 응용을 위한 $(InSb)_{2}Te_{3}$ 칼코게나이드 화합물의 상변화특성 연구 = Phase Change Characteristics of $(InSb)_{2}Te_{3}$ Chalcogenide Alloys for Application in Phase Change Memorylink 윤재진; Yun, Jae-Jin; et al, 한국과학기술원, 2011 |
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