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DIII-D research advancing the physics basis for optimizing the tokamak approach to fusion energy Fenstermacher M. E.; Abbate J.; Abe S.; Abrams T.; Adams M.; Adamson B.; Aiba N.; et al, NUCLEAR FUSION, v.62, no.4, 2022-04 |
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee W.S.; Byun K.Y.; Han I.Y.; Kim, SungJin; Yu J., THERMOCHIMICA ACTA, v.455, no.1-2, pp.148 - 155, 2007-04 |
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