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Showing results 1 to 4 of 4

1
Analysis and Optimization of a Power Distribution Network in 2.5D IC with Glass Interposer

Kim, Joungho; Jonghyun Cho; Kiyeong Kim; Heegon Kim; Srikrishna Sitaraman; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01

2
Design and Analysis of Receiver Channels of Glass Interposer for Dual Band Wi-Fi Front End Module (FEM)

Kim, Joungho; Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Kim, Minsuk; Pulugurtha Markondeya Raj; Venky Sundaram; et al, IEEE International Symposium on Electromagnetic Compatibility, IEEE International Symposium on Electromagnetic Compatibility, 2017-08-09

3
Noise Coupling Modeling and Analysis of Through Glass Via(TGV)

Kim, Joungho; Kim, Jihye; Kim, Youngwoo; Cho, Jonghyun; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31

4
Precise RLGC Modeling and Analysis of Through Glass Via (TGV) for 2.5D/3D IC

Kim, Joungho; Insu Hwang; Youngwoo Kim; Jonghyun Cho; Venky Sundaram,; Rao Tummala, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28

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