Browse "College of Engineering(공과대학)" by Author Pecht, M
Showing results 1 to 2 of 2
| Effects of Humidity Cycling on Polymer Overlaid High Density Interconnects Paik, Kyung-Wook; Li, X; Pecht, M; Bernard, E, Proceeding of IEEE-CHMT VLSI packaging workshop, pp.11 - 13, 1993-10-01 |
| Relative humidity cycle testing on GE-HDI Li, M; Wu, X; Pecht, M; Paik, Kyung-Wook; Bernard, E, INTERNATIONAL JOURNAL OF MICROELECTRONIC PACKAGING, v.1, no.1, pp.13 - 34, 1995-01 |
Discover
Open Access
Date issued
- 23,074 2020 - 2024
- 75,360 2010 - 2019
- 57,250 2000 - 2009
- 30,842 1990 - 1999
- 9,025 1980 - 1989