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Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures Piersanti, Stefano; de Paulis, Francesco; Olivieri, Carlo; Jung, Daniel Hyunsuk; Kim, Joungho; Orlandi, Antonio, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.5, pp.1558 - 1564, 2017-10 |
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