Browse "College of Engineering(공과대학)" by Author Doan, JC
Showing results 1 to 3 of 3
| A high-voltage scanning electron microscopy system for in situ electromigration testing Doan, JC; Lee, S; Lee, Seok-Hee; Meier, NE; Bravman, JC; Flinn, PA; Marieb, TN; et al, REVIEW OF SCIENTIFIC INSTRUMENTS, v.71, no.7, pp.2848 - 2854, 2000-07 |
| Stress-induced and electromigration voiding in aluminum interconnects passivated with silicon nitride Lee, Seok-Hee; Bravman, JC; Doan, JC; Lee, S; Flinn, PA; Marieb, TN, JOURNAL OF APPLIED PHYSICS, v.91, no.6, pp.3653 - 3657, 2002-03 |
| Void nucleation on intentionally added defects in Al interconnects Doan, JC; Lee, Seok-Hee; Bravman, JC; Flinn, PA; Marieb, TN, APPLIED PHYSICS LETTERS, v.75, no.5, pp.633 - 635, 1999-08 |
Discover
Open Access
Date issued
- 23,006 2020 - 2024
- 75,360 2010 - 2019
- 57,250 2000 - 2009
- 30,842 1990 - 1999
- 9,025 1980 - 1989