Browse "College of Engineering(공과대학)" by Author Ahn, JY
Showing results 1 to 9 of 9
| Adaptive modulation for MIMO systems with V-BLAST detection Lee, Yong-Hoon; Kim, YD; Kim, IH; Choi, JH; Ahn, JY, VTC Spring 2003, IEEE, 2003-04 |
| Amorphous silicon solar cells with stable protocrystalline silicon and unstable microcrystalline silicon at the onset of a microcrystalline regime as i-layers Ahn, JY; Lim, Koeng Su, JOURNAL OF NON-CRYSTALLINE SOLIDS, v.351, pp.748 - 753, 2005-04 |
| Continuous measurement of solids flow in a circulating fluidized bed Kim, SW; Ahn, JY; Lee, DH; Kim, Sang-Done, KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.18, no.4, pp.555 - 560, 2001-07 |
| Efficient extraction of schemas for XML documents Min, JK; Ahn, JY; Chung, Chin-Wan, INFORMATION PROCESSING LETTERS, v.85, pp.7 - 12, 2003-01 |
| Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications Yim, MJ; Jung, IH; Choi, HK; Kim, K; Hwang, JS; Ahn, JY; Kwon, W; et al, 53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403, IEEE, 2003-05-27 |
| Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12 |
| Highly Reliable Flip Chip on Flex Package using Multi-layered Anisotropic Conductive Film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp.0 - 0, 2002-12 |
| Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.76 - 82, 2004-01 |
| Stable protocrystalline silicon and unstable microcrystalline silicon at the onset of a microcrystalline regime Ahn, JY; Jun, KH; Lim, Koeng Su; Konagai, M, APPLIED PHYSICS LETTERS, v.82, pp.1718 - 1720, 2003-03 |
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