Showing results 16 to 20 of 20
Reactive ion etching mechanism of copper film in chlorine-based electron cyclotron resonance plasma Lee, SK; Chun , Soung Soon; Hwang, CY; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.1A, pp.50 - 55, 1997-01 |
Reactive ion etching mechanism of RuO2 thin films in oxygen plasma with the addition of CF4, Cl-2, and N-2 Lee, EJ; Kim, JW; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.37, no.5A, pp.2634 - 2641, 1998-05 |
The effect of Ni loading and the sulfidation temperature on the structure and catalytic activity of Ni-W hydrodesulfurization catalysts Kim, CH; Yoon, WL; Lee, IC; Woo, Seong-Ihl, APPLIED CATALYSIS A-GENERAL, v.144, no.1-2, pp.159 - 175, 1996-09 |
Water-induced degradation of chromium fluoride films Kim, EN; Hong, Daniel Seungbum; Gorman, JD; Lim, SC; Moon, SY; Kim, DW; No, Kwangsoo, THIN SOLID FILMS, v.324, no.1-2, pp.292 - 299, 1998-07 |
Work function investigations of Al-doped ZnO for band-alignment in electronic and optoelectronic applications Drewelow, Grant; Reed, Austin; Stone, Chandon; Roh, Kwangdong; Jiang, Zhong-Tao; Linh Nguyen Thi Truc; No, Kwangsoo; et al, APPLIED SURFACE SCIENCE, v.484, pp.990 - 998, 2019-08 |
Discover