Flip Chip 접속을 위한 무전해 니켈 범프의 형성 및 특성 연구Fabrication and Characteristics of Electroless Ni Bump for Flip Chip Interconnection
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 전영두 | ko |
| dc.contributor.author | 임명진 | ko |
| dc.contributor.author | 백경욱 | ko |
| dc.date.accessioned | 2013-02-27T17:12:02Z | - |
| dc.date.available | 2013-02-27T17:12:02Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1999-11 | - |
| dc.identifier.citation | 한국재료학회지, v.9, no.11, pp.1095 - 1101 | - |
| dc.identifier.issn | 1225-0562 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/69768 | - |
| dc.language | Korean | - |
| dc.publisher | 한국재료학회 | - |
| dc.title | Flip Chip 접속을 위한 무전해 니켈 범프의 형성 및 특성 연구 | - |
| dc.title.alternative | Fabrication and Characteristics of Electroless Ni Bump for Flip Chip Interconnection | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 9 | - |
| dc.citation.issue | 11 | - |
| dc.citation.beginningpage | 1095 | - |
| dc.citation.endingpage | 1101 | - |
| dc.citation.publicationname | 한국재료학회지 | - |
| dc.contributor.localauthor | 백경욱 | - |
| dc.description.isOpenAccess | N | - |
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