DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, DH | ko |
dc.contributor.author | Nam, Soo Woo | ko |
dc.contributor.author | Choe, SJ | ko |
dc.date.accessioned | 2013-02-27T16:31:25Z | - |
dc.date.available | 2013-02-27T16:31:25Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2000-10 | - |
dc.identifier.citation | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.291, no.1-2, pp.60 - 67 | - |
dc.identifier.issn | 0921-5093 | - |
dc.identifier.uri | http://hdl.handle.net/10203/69605 | - |
dc.description.abstract | The influence of lamellar or bi-modal microstructures on high temperature LCF behavior in Ti-1100 was investigated at 600 degrees C. Under various creep-fatigue conditions, as the hold-time increases, the fatigue lives of specimens of both lamellar and bi-modal structures reduce compared with those of continuous cycling of the same specimens. it is understood that longer hold-time results in severe creep damage accumulation due to stress relaxation, leading to reduced fatigue life. Specimens with a bi-modal structure show about double the values of relaxed stress normalized with tensile peak stress of specimens with lamellar structure in the same test conditions, resulting in a higher reduction rate of fatigue life. In addition, as hold-time extends, the difference in total hysteresis loop energy between lamellar and bi-modal structures becomes smaller. Therefore, it can be said that creep damage resulting from stress relaxation during hold-time is more detrimental in bi-modal than in lamellar structures. (C) 2000 Published by Elsevier Science S.A. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.subject | NEAR-ALPHA TI-1100 | - |
dc.subject | LAMELLAR STRUCTURE | - |
dc.subject | ALLOY | - |
dc.title | Effect of microstructure and relaxation behavior on the high temperature low cycle fatigue of near-alpha-Ti-1100 | - |
dc.type | Article | - |
dc.identifier.wosid | 000089249100009 | - |
dc.type.rims | ART | - |
dc.citation.volume | 291 | - |
dc.citation.issue | 1-2 | - |
dc.citation.beginningpage | 60 | - |
dc.citation.endingpage | 67 | - |
dc.citation.publicationname | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | - |
dc.identifier.doi | 10.1016/S0921-5093(00)00974-6 | - |
dc.contributor.nonIdAuthor | Lee, DH | - |
dc.contributor.nonIdAuthor | Choe, SJ | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | near-alpha-Ti-1100 alloy | - |
dc.subject.keywordAuthor | creep-fatigue | - |
dc.subject.keywordAuthor | microstructure | - |
dc.subject.keywordPlus | NEAR-ALPHA TI-1100 | - |
dc.subject.keywordPlus | LAMELLAR STRUCTURE | - |
dc.subject.keywordPlus | ALLOY | - |
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