A high fill-factor infrared bolometer using micromachined multilevel electrothermal structures

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A high fill-factor uncooled infrared (IR) bolometer has been fabricated by using thin-film titanium resistors sandwiched in a surface-micromachined silicon oxinitride membrane (50 mu m x 50 mu m). This bolometer is realized in multilevel electrothermal structures with a fill-factor over 92%. From the multilevel structure, thermal isolation can be independently optimized without sacrificing LR absorbing area. Initial measurements show a thermal time constant of 12 ms, a responsivity of 1600 V/W, and a detectivity (D*) of 5 x 10(8) cm root Hz/W.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
1999-07
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON ELECTRON DEVICES, v.46, no.7, pp.1489 - 1491

ISSN
0018-9383
URI
http://hdl.handle.net/10203/68470
Appears in Collection
EE-Journal Papers(저널논문)RIMS Journal Papers
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