Sn-Bi 합금도금층의 미세조직에 미치는 도금변수의 영향 및 Sn-Bi/Cu 계면에서의 금속간 화합물의 성장Effects of plating Parameters on the Microstructure of 80Sn-20Pb Electrodeposits from an Organic Sulfonate Bath
- Publisher
- 한국부식방식학회
- Issue Date
- 1994-01
- Language
- Korean
- Citation
CORROSION SCIENCE AND TECHNOLOGY, v.23, pp.11 - 22
- ISSN
- 1598-6462
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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