온도사이클을 받는 Solder Joint의 피로수명에 관한 연구A Study on the Fatigue Life Prediction of Solder Joints Under Thermal Cyclic LOADING
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김진기 | ko |
| dc.contributor.author | 이순복 | ko |
| dc.date.accessioned | 2013-02-27T05:07:03Z | - |
| dc.date.available | 2013-02-27T05:07:03Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1994 | - |
| dc.identifier.citation | 전자공학회지, v.31, no.12, pp.1660 - 1671 | - |
| dc.identifier.issn | 1975-2377 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/66605 | - |
| dc.description.abstract | This study is to apply the theory of fatigue fracture to solder joints under thermal cyclic loading and predict life of solder joint to failure. A 62Sn-36Pb-2Ag solder was used in this study. Tensile tests were preformed at temperatures of 15.dec. C, 50.dec. C and 85.dec. C in order to find terms of crack length "a". plastic strain range ""${\Delta}{\varepsilon}_p$" and temperature "T". Solder joint under thermal cyclic loading was analyzed by FEM. this FEM analysis together with the crack growth rate will provide the capability of the fatigue life prediction of solder joints and enhance the reliability od solder joint. | - |
| dc.language | Korean | - |
| dc.publisher | 대한전자공학회 | - |
| dc.title | 온도사이클을 받는 Solder Joint의 피로수명에 관한 연구 | - |
| dc.title.alternative | A Study on the Fatigue Life Prediction of Solder Joints Under Thermal Cyclic LOADING | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 31 | - |
| dc.citation.issue | 12 | - |
| dc.citation.beginningpage | 1660 | - |
| dc.citation.endingpage | 1671 | - |
| dc.citation.publicationname | 전자공학회지 | - |
| dc.contributor.localauthor | 이순복 | - |
| dc.contributor.nonIdAuthor | 김진기 | - |
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