APPLICATIONS OF RAPID THERMAL CHEMICAL-VAPOR-DEPOSITION TECHNOLOGY TO ULSI MATERIAL PROCESSING AND DEVICE FABRICATION

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Rapid thermal chemical vapor deposition (RT-CVD) has received considerable attention as a novel in situ multiprocessing tool capable of meeting the stringent requirements of ULSI manufacturing. In this paper, we review the significant benefits provided by RT-CVD for IC manufacturing and the progress made in developing RT-CVD as an integrated processing module for ULSI device fabrication.
Publisher
ELSEVIER SCIENCE SA LAUSANNE
Issue Date
1994-04
Language
English
Article Type
Article; Proceedings Paper
Citation

THIN SOLID FILMS, v.241, no.1-2, pp.329 - 334

ISSN
0040-6090
DOI
10.1016/0040-6090(94)90451-0
URI
http://hdl.handle.net/10203/65548
Appears in Collection
EE-Journal Papers(저널논문)
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