ELIMINATION OF SLIPS ON SILICON-WAFER EDGE IN RAPID THERMAL-PROCESS BY USING A RING OXIDE
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Cho, Byung Jin | ko |
| dc.contributor.author | Kim, Choong Ki | ko |
| dc.date.accessioned | 2013-02-25T20:26:27Z | - |
| dc.date.available | 2013-02-25T20:26:27Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1990-06 | - |
| dc.identifier.citation | JOURNAL OF APPLIED PHYSICS, v.67, no.12, pp.7583 - 7586 | - |
| dc.identifier.issn | 0021-8979 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/65037 | - |
| dc.language | English | - |
| dc.publisher | AMER INST PHYSICS | - |
| dc.title | ELIMINATION OF SLIPS ON SILICON-WAFER EDGE IN RAPID THERMAL-PROCESS BY USING A RING OXIDE | - |
| dc.type | Article | - |
| dc.identifier.wosid | A1990DF23900058 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 67 | - |
| dc.citation.issue | 12 | - |
| dc.citation.beginningpage | 7583 | - |
| dc.citation.endingpage | 7586 | - |
| dc.citation.publicationname | JOURNAL OF APPLIED PHYSICS | - |
| dc.identifier.doi | 10.1063/1.345824 | - |
| dc.contributor.localauthor | Cho, Byung Jin | - |
| dc.type.journalArticle | Article | - |
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