DC Field | Value | Language |
---|---|---|
dc.contributor.author | Y.T.Kim | ko |
dc.contributor.author | S.K.Min | ko |
dc.contributor.author | J.S.Hong | ko |
dc.contributor.author | Kim, Choong Ki | ko |
dc.date.accessioned | 2013-02-25T17:36:29Z | - |
dc.date.available | 2013-02-25T17:36:29Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1991-04 | - |
dc.identifier.citation | JAPANESE JOURNAL OF APPLIED PHYSICS, v.30, no.4, pp.820 - 826 | - |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.uri | http://hdl.handle.net/10203/63988 | - |
dc.description.abstract | We have studied the properties of plasma-enhanced chemical vapor deposited tungsten (PECVD-W) thin films according to the variations of reactant mixtures, SiH4/WF6 ratio, deposition temperature and RF power density. As the result, it is found that the resistivity of PECVD-W is reduced from 70 to 40-mu-OMEGA-cm with the addition of SiH4 (SiH4/WF6 ratio = 1) even at a lower temperature (220-degrees-C) than in the previous works. For the further reduction of resistivity, with increasing deposition temperature from 220 to 360-degrees-C, 40-mu-OMEGA-cm is reduced to 10-mu-OMEGA-cm, and (110), (200) and (211) oriented alpha-phase grain growth is observed. The deposition rate is increased with the increase of the SiH4/WF6 ratio up to 1.5. However, at the SiH4/WF6 ratio of 2, the deposition rate decreases and beta peaks are observed at the expense of the alpha-phase. The Auger in-depth profile indicates that 20 atomic % is incorporated into the deposition process. | - |
dc.language | English | - |
dc.publisher | Japan Soc Applied Physics | - |
dc.subject | CHEMICAL VAPOR-DEPOSITION | - |
dc.subject | INTERCONNECT MATERIALS | - |
dc.subject | VLSI CIRCUITS | - |
dc.title | Highly Conductive Tungsten Thin Films Prepared by the Plasma-Assisted Silane Reduction Process | - |
dc.type | Article | - |
dc.identifier.wosid | A1991FL20500042 | - |
dc.identifier.scopusid | 2-s2.0-0026141155 | - |
dc.type.rims | ART | - |
dc.citation.volume | 30 | - |
dc.citation.issue | 4 | - |
dc.citation.beginningpage | 820 | - |
dc.citation.endingpage | 826 | - |
dc.citation.publicationname | JAPANESE JOURNAL OF APPLIED PHYSICS | - |
dc.contributor.nonIdAuthor | Y.T.Kim | - |
dc.contributor.nonIdAuthor | S.K.Min | - |
dc.contributor.nonIdAuthor | J.S.Hong | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | PECVD | - |
dc.subject.keywordAuthor | TUNGSTEN THIN FILMS | - |
dc.subject.keywordAuthor | SILANE REDUCTION | - |
dc.subject.keywordAuthor | DEPOSITION TEMPERATURE | - |
dc.subject.keywordAuthor | CRYSTAL STRUCTURE | - |
dc.subject.keywordAuthor | RESISTIVITY | - |
dc.subject.keywordPlus | CHEMICAL VAPOR-DEPOSITION | - |
dc.subject.keywordPlus | INTERCONNECT MATERIALS | - |
dc.subject.keywordPlus | VLSI CIRCUITS | - |
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