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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Compensation of ESD and Input Capacitance Effect by Using Package Bond-wire Inductance for Over Gbps Differential SerDes Devices

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Ahn, Seungyoung / Park, Jongbae / Chung, Daehyun / Kim, Jounghoresearcher
Publisher
IEEE
Issue Date
2003-10-27
Language
English
Citation

IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.159 - 162

URI
http://hdl.handle.net/10203/637
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EE-Conference Papers(학술회의논문)
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