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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Design and strength evaluation of an anodically bonded pressurized cavity array for wafer-level MEMS packaging Go, Jeung Sang; Cho, Young-Ho, Inter. Mechanical Engineering Congress and Exposition (IMECE '98),, v.66, pp.357 - 360, 1998-11-15 | |
| A Long-Stroke Thermopneumatic Actuator for Applications to Microflow and Pressure Regulation Kang, Tae Goo; Seo, Kyoung-Sun; Cho, Young-Ho; Baek, OH; Hwang, WL; Moon, JH, International Conference on New actuators, pp.62 - 65, 1998-06 | |
| Design and fabrication of piezoresistive cantilever microaccelerometer arrays with a symmetrically bonded proof-mass Ko Jong Soo; Cho, Young-Ho; Kwak Byung Man; Park Kwanhum, Inter. Mechanical Engineering Congress and Exposition(IMECE '98), ASME, v.66, pp.353 - 356, 1998-11-15 | |
| Analysis and Characterization of Laterally Induced Electrostatic Repulsive Forces Lee, Ki Bang; Cho, Young-Ho, Inter. Conf. on Modeling and Simulation of Microsystems, Semiconductors, Sensors and Actuators, pp.218 - 221, 1998-04-06 | |
| Design, Fabrication and Uncertainty Evaluation of a Surface-micromachined Capacitive Microaccelerometer Han, KH; Kim, JP; Cho, Young-Ho, Inter. Mechanical Engineering Congress and Exposition (IMECE '98), ASME, pp.347 - 352, 1998-11-15 | |
| Experimental evaluation of anodic bonding process using Taguchi method for maximum interfacial fracture toughness Sang, Go Jeung; Cho, Young-Ho, Proceedings of the IEEE 11th Annual International Workshop on Micro Electro Mechanical Systems, 1998, pp.318 - 321, IEEE, 1998-01-25 |
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