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Locally heated low temperature wafer level mems packaging with closed-loop AuSn solder-lines Seo, YH; Kang, TG; Cho, Young-Ho; Kim, SA; Kim, GH; Bu, JU, ASME 2002 International Mechanical Engineering Congress and Exposition, IMECE2002, pp.33 - 37, 2002-11-17 |
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