Kim, Ji-Young; Rehman, Abdul; Ryu, Hyemin; Oh, Injong; Sim, Gi-Dong, Materials Science and Engineering: A, v.912, 2024-10
Song, Yeo-Ul; Song, Byeong Uk; Jung, Min-Kyo; Lee, Changwoo; Choi, Joon Phil; Lee, Ikjin, JOURNAL OF MANUFACTURING PROCESSES, v.127, pp.107 - 114, 2024-10
Ryu, Hyemin; Lee, Zhuo Feng; Kim, Ji-Young; Choi, Sunkun; Sim, Gi-Dong, Scripta Materialia, v.250, pp.116189, 2024-09
Bae, Junhyuk; Ghilardi, Giorgio; Jeong, Sangkwon, CRYOGENICS, v.142, 2024-09
Yoon, Siwon; Seo, Junyong; Jung, Junbo; Choi, Minwoo; Lee, Bong Jae; Kim, Joong Bae, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.227, 2024-08
Ha, Jihwan; Ko, Jiwoo; Ahn, Junseong; Jeong, Yongrok; Ahn, Jihyeon; Hwang, Soonhyoung; Jeon, Sohee; Kim, Dahong; Park, Su A; Gu, Jimin; Choi, Jungrak; Han, Hyeonseok; Han, Chankyu; Kang, Byeongmin; Kang, Byung-Ho; Cho, Seokjoo; Kwon, Yeongjae; Kim, Cheolmin; Choi, Sunkun; Sim, Gi-Dong; Jeong, Jun‐Ho; Park, Inkyu, Advanced Functional Materials, v.34, no.33, pp.2401404, 2024-08
Lee, Hugon; Lee, Min Gyu; Jung, Jiyoung; Lee, Ikjin; Ryu, Seunghwa, ADVANCED THEORY AND SIMULATIONS, v.7, no.8, 2024-08
Kim, Ki Jong; Kim, Daegyoum, OCEAN ENGINEERING, 2024-07
Lee, Gil-Yong; Park, Kangjae; Lim, Dae-Guen; Park, Yong-Hwa, JOURNAL OF SOUND AND VIBRATION, v.582, 2024-07
Ma, Yupeng; Pan, Zhenyu; Liu, Yifei; Zhao, Kunpeng; Xiao, Jie; Nam, Donguk; Wei, Tian-Ran; Shi, Xun, MATERIALS TODAY ENERGY, v.43, 2024-07
Fabrication of a ZnO piezoelectric micro cantilever with a high-aspect-ratio nano tip Lee, SH; Lee, Seung Seob; Choi, JJ; Jeon, JU; Ro, K, MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, v.11, no.6, pp.416 - 423, 2005-05 |
A novel fabrication process for out-of-plane microneedle sheets of biocompatible polymer Han, Manhee; Hyun, Dong-Hun; Park, Hyoun-Hyang; Lee, Seung Seob; Kim, Chang-Hyeon; Kim, ChangGyou, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.17, no.6, pp.1184 - 1191, 2007-06 |
Equations of exposure time and X-ray mask absorber thickness in the LIGA process Gil, KH; Lee, Seung Seob; Youm, Y, MICROSYSTEM TECHNOLOGIES, v.7, no.1, pp.1 - 5, 2001-03 |
Micro heat flux sensor using copper electroplating in SU-8 microstructures Oh, SH; Lee, KC; Chun, J; Kim, M; Lee, Seung Seob, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.11, no.3, pp.221 - 225, 2001-05 |
Novel micropumps using gases as pumping sources Choi, YH; Son, SU; Lee, Seung Seob, ADVANCES IN NONDESTRUCTIVE EVALUATION, PT 1-3 BOOK SERIES: KEY ENGINEERING MATERIALS, v.270-273, pp.1 - 3, 2004 |
A novel method of microneedle array fabrication using inclined deep x-ray exposure Moon S.J.; Jin C.Y.; Lee, Seung Seob, JOURNAL OF PHYSICS: CONFERENCE SERIES, v.34, no.1, pp.180 - 186, 2006-04 |
A simple method for microlens fabrication by the modified LIGA process Lee, SK; Lee, KC; Lee, Seung Seob, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.12, no.3, pp.334 - 340, 2002-05 |
Self-excited piezoelectric cantilever oscillators Lee, Seung Seob; White, RM, SENSORS AND ACTUATORS A-PHYSICAL, v.52, no.1-3, pp.41 - 45, 1996 |
Effect of the shape of imprinted alignment layer on the molecular orientation of liquid crystal Hah, Hyundae; Sung, Shi-Joon; Han, Manhee; Lee, Seung Seob; Park, Jung-Ki, MATERIALS SCIENCE & ENGINEERING C-BIOMIMETIC AND SUPRAMOLECULAR SYSTEMS, v.27, no.4, pp.798 - 801, 2007-05 |
Piezoelectric cantilever acoustic transducer Lee, Seung Seob; White, RM, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.8, no.3, pp.230 - 238, 1998-09 |
Piezoelectric cantilever voltage-to-frequency converter Lee, Seung Seob; White, RM, SENSORS AND ACTUATORS A-PHYSICAL, v.71, no.1-2, pp.153 - 157, 1998-11 |
Dual-axis microgyroscope with closed-loop detection An, S; Oh, YS; Park, KY; Lee, Seung Seob; Song, CM, SENSORS AND ACTUATORS A-PHYSICAL, v.73, no.1-2, pp.1 - 6, 1999-03 |
A tetrahedral three-facet micro mirror with the inclined deep X-ray process Oh, DY; Gil, K; Chang, SS; Jung, DK; Park, NY; Lee, Seung Seob, SENSORS AND ACTUATORS A-PHYSICAL, v.93, no.2, pp.157 - 161, 2001-09 |
Micromachined piezoelectric membrane acoustic device Kim, YC; Lee, Seung Seob; Choi, SH; Kim, SR; Ko, SC, SENSORS AND ACTUATORS A-PHYSICAL, v.103, no.1-2, pp.130 - 134, 2003-01 |
Shrinkage ratio of PDMS and its alignment method for the wafer level process Lee, Seok Woo; Lee, Seung Seob, MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, v.14, no.2, pp.205 - 208, 2008-02 |
Deep X-ray lithography using mask with integrated electrothermal actuator Lee, KC; Lee, Seung Seob, MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, v.11, no.4-5, pp.358 - 364, 2005-04 |
Fabrication of a flip chip solder bump using a thin mold and ultrasonic filling Nam, Dong Jin; Lee, Jae Hak; Lee, Jihye; Yoo, Choong Don, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.17, no.9, pp.1863 - 1869, 2007-09 |
Modelling and vibration analysis of misaligned rotor-ball bearing systems Lee, YS; Lee, Chong-Won, JOURNAL OF SOUND AND VIBRATION, v.224, no.1, pp.17 - 32, 1999-07 |
MODELING AND VIBRATION ANALYSIS OF A SIMPLE ROTOR WITH A BREATHING CRACK JUN, OS; EUN, HJ; Earmme, Youn-Young; Lee, Chong-Won, JOURNAL OF SOUND AND VIBRATION, v.155, no.2, pp.273 - 290, 1992-06 |
FINITE-ELEMENT ANALYSIS OF ROTOR BEARING SYSTEMS USING A MODAL TRANSFORMATION MATRIX KIM, YD; Lee, Chong-Won, JOURNAL OF SOUND AND VIBRATION, v.111, no.3, pp.441 - 456, 1986-12 |
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