ME-Journal Papers(저널논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 11741 to 11760 of 12216

11741
Dynamic measurement and modeling of soft tissue behavior with an indentation device using indenters of various shapes

An, B.; Kim, Jung, KEY ENGINEERING MATERIALS, v.326-328 I, no.0, pp.781 - 784, 2006

11742
Thermomechanical fatigue behavior of the ferritic stainless steel

Lee, KO; Hong, SG; Yoon, S; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.1 - 4, 2005

11743
Calculation of local stress-strain behavior at notches for non-masing material under cyclic loading

Lim, JY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.1 - 4, 2005

11744
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

11745
Realization of high sensitivity displacement field from moire interferometer with rough phase shifting mechanism and pattern matching technique

Yang, SY; Lee, Soon-Bok, OPTICS AND LASERS IN ENGINEERING, v.43, no.6, pp.721 - 736, 2005-06

11746
Dynamic strain aging effect on the fatigue resistance of type 316L stainless steel

Hong, SG; Lee, KO; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.27, pp.1420 - 1424, 2005-10

11747
A new high temperature life correlation model for austenitic and ferritic stainless steels

Lee, KO; Hong, SG; Yoon, S; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.27, no.10, pp.1559 - 1563, 2005-10

11748
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02

11749
Inverse method to determine mechanical properties of thin film by nanoindentation and finite element analysis

Baek, D.-C.; Lee, Soon-Bok, KEY ENGINEERING MATERIALS, v.326-328 I, no.0, pp.219 - 222, 2006

11750
Ultrasonic transmission characteristics of continuous casting slab for medium carbon steel

Lee, JY; Lee, Soon-Bok; Yi, JK, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.1 - 4, 2005

11751
Purification of carbon nanotubes through an electric field near the arranged microelectrodes

Shim, Hyung Cheoul; Lee, Hyung Woo; Yeom, Sujin; Kwak, Yoon Keun; Lee, Seung Seob; Kim, Soo Hyun, NANOTECHNOLOGY, v.18, no.11, pp.604 - 610, 2007-03

11752
Experimental investigation on the proper fatigue parameter of cyclically non-stabilized materials

Hong, SG; Lee, KO; Lim, JY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.2477 - 2482, 2005

11753
Effects of microstructure on material Behaviors of solder alloys

Hwang, TK; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.1 - 4, 2005

11754
Application of local stress-strain approaches in the prediction of fatigue crack initiation life for cyclically non-stabilized and non-Masing steel

Lim, JY; Hong, SG; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.27, no.10-12, pp.1653 - 1660, 2005-10

11755
Mechanism of dynamic strain aging and characterization of its effect on the low-cycle fatigue behavior in type 316L stainless steel

Hong, SG; Lee, Soon-Bok, JOURNAL OF NUCLEAR MATERIALS, v.340, no.2-3, pp.307 - 314, 2005-04

11756
Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF)

Park, J.-H.; Chung, C.-K.; Paik, Kyung-Wook; Lee, Soon-Bok, KEY ENGINEERING MATERIALS, v.326-328, no.0, pp.517 - 520, 2006

11757
The measurement of residual deformation in PBGA package after reflow process using a newly developed laser profiler

Kim, I.; Yoon, J.Y.; Lee, Soon-Bok, KEY ENGINEERING MATERIALS, v.326-328 I, no.0, pp.513 - 516, 2006

11758
A Novel Description of Thermomechanical Behavior Using a Rheological Model

Lee, Keum-Oh; Hong, Seung-Gu; Lee, Soon-Bok, Key Engineering Materials Vols. 306-308 (2006) pp. 205-210, 2006-06

11759
Phenomenological description of cyclic deformation using the overlay model

Yoon, S; Hong, SG; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.364, pp.17 - 26, 2004-01

11760
Diagnosis of sensor faults in active magnetic bearing system equipped with built-in force transducers

Kim, SJ; Lee, Chong-Won, IEEE-ASME TRANSACTIONS ON MECHATRONICS, v.4, no.2, pp.180 - 186, 1999-06

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