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NO	Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1	Avoidance of fabricational thermal residual stresses in co-cure bonded metal-composite hybrid structures Kim, Hak Sung; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.20, no.9, pp.959 - 979, 2006
2	Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry Kim, HS; Lee, Dai Gil, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01
3	Effects of applied pressure and temperature during curing operation on the strength of tubular single-lap adhesive joints Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.18, no.1, pp.87 - 107, 2004

Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)

Kim, Hak Sung; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.20, no.9, pp.959 - 979, 2006

Kim, HS; Lee, Dai Gil, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01

Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.18, no.1, pp.87 - 107, 2004

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