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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Fatigue of polymer-supported Ag thin films Sim, Gidong; Hwangbo, Yun; Kim, Hyun-Ho; Lee, Soon-Bok; Vlassak, Joost J., SCRIPTA MATERIALIA, v.66, no.11, pp.915 - 918, 2012-06 | |
| Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 | |
| Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints Lee, K. O.; Yu, Jin; Park, T. S.; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03 | |
| Role of Graphene in Reducing Fatigue Damage in Cu/Gr Nanolayered Composite Hwang, Byungil; Kim, Wonsik; Kim, Jaemin; Lee, Subin; Lim, Seoyoen; Kim, Sangmin; Oh, Sang Ho; Ryu, Seunghwa; Han, Seung Min, NANO LETTERS, v.17, no.8, pp.4740 - 4745, 2017-08 | |
| Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07 | |
Tensile testing of ultra-thin films on water surface Kim, Jae-Han; Nizami, Adeel; Hwangbo, Yun; Jang, Bongkyun; Lee, Hak-Joo; Woo, Chang-Su; Hyun, Seungmin; Kim, Taek-Soo, NATURE COMMUNICATIONS, v.4, 2013-10 |
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