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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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In situ cure monitoring of adhesively bonded joints by dielectrometry Kwon, JW; Chin, WS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, pp.2111 - 2130, 2003 | |
Dielectric cure monitoring for glass/polyester prepreg composites Kim, HG; Lee, Dai Gil, COMPOSITE STRUCTURES, v.57, no.1-4, pp.91 - 99, 2002-07 |
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