Search
Results 1-10 of 18 (Search time: 0.003 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A high aspect ratio serpentine structure for use as a strain-insensitive, stretchable transparent conductor Jang, Sungwoo; Kim, Cheolgyu; Park, Jung Jin; Jin, Ming Liang; Kim, Seon Joon; Park, O Ok; Kim, Taek-Soo; Jung, Hee-Tae, SMALL, v.14, no.8, 2018-02 | |
| Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations Pyo, Jae-Bum; Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, SOFT MATTER, v.12, no.18, pp.4135 - 4141, 2016-03 | |
| Reversible self-bending soft hydrogel microstructures with mechanically optimized designs Kim, Jongmin; Kim, Cheolgyu; Song, YoungShin; Jeong, Seong-Geun; Kim, Taek-Soo; Lee, Chang-Soo, CHEMICAL ENGINEERING JOURNAL, v.321, pp.384 - 393, 2017-08 | |
| Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.73, pp.136 - 145, 2017-06 | |
| Nanotransplantation Printing of Crystallographic-Orientation-Controlled Single-Crystalline Nanowire Arrays on Diverse Surfaces Han, Hyeuk Jin; Jeong, Jae Won; Yang, Se Ryeun; Kim, Cheolgyu; Yoo, Hyeon Gyun; Yoon, Jun-Bo; Park, Jaehong; Lee, Keon Jae; Kim, Taek-Soo; Kim, Seong-Woong; Jung, Yeon Sik, ACS NANO, v.11, no.11, pp.11642 - 11652, 2017-11 | |
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 | |
| Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, COMPOSITE STRUCTURES, v.176, pp.973 - 981, 2017-09 | |
| Flash-Induced Stretchable Cu Conductor via Multiscale-Interfacial Couplings Park, Jung Hwan; Seo, Jeongmin; Kim, Cheolgyu; Joe, Daniel Juhyung; Lee, Han Eol; Im, Tae Hong; Seok, Jae Young; Jeong, Chang Kyu; Ma, Boo Soo; Park, Hyung Kun; Kim, Taek-Soo; Lee, Keon Jae, ADVANCED SCIENCE, v.5, no.11, pp.1801146, 2018-10 | |
| Flexural and tensile moduli of flexible FR4 substrates Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, POLYMER TESTING, v.53, pp.70 - 76, 2016-08 | |
| Mechanical Stability Analysis via Neutral Mechanical Plane for High-Performance Flexible Si Nanomembrane FDSOI Device Kim, Seung-Yoon; Bong, Jae Hoon; Kim, Cheolgyu; Hwang, Wan Sik; Kim, Taek-Soo; Cho, Byung Jin, ADVANCED MATERIALS INTERFACES, v.4, no.21, 2017-11 |
Discover
Type
- 18 Article