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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07 | |
Tensile testing of ultra-thin films on water surface![]() Kim, Jae-Han; Nizami, Adeel; Hwangbo, Yun; Jang, Bongkyun; Lee, Hak-Joo; Woo, Chang-Su; Hyun, Seungmin; Kim, Taek-Soo, NATURE COMMUNICATIONS, v.4, 2013-10 |
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