Browse "ME-Journal Papers(저널논문)" by Subject warpage
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| Prediction of shrinkage and warpage in consideration of residual stress in integrated simulation of injection molding Choi, DS; Im, Yong-Taek, COMPOSITE STRUCTURES, v.47, no.1-4, pp.655 - 665, 1999-12 |
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 |
| 단면 연마된 실리콘 웨이퍼의 열에 의한 휨 거동 김준모; 구창연; 김택수, 마이크로전자 및 패키징학회지, v.27, no.3, pp.89 - 93, 2020-09 |
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