Browse "ME-Journal Papers(저널논문)" by Subject thermomechanical analysis
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| A study on the thermomechanical behavior of semiconductor chips on thin silicon substrate Lim, Jae Hyuk; Han, ManHee; Lee, Jun-Youn; Earmme, Youn Young; Lee, Soon-Bok; Im, Seyoung, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.22, no.8, pp.1483 - 1489, 2008-08 |
| Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: Prediction and measurement Kwon, Woon-Seong; Yang, Se-Young; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.29, no.3, pp.688 - 695, 2006-09 |
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