Browse "ME-Journal Papers(저널논문)" by Subject thermal stress
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| A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks Lee, H; Earmme, Youn-Young, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, v.19, no.2, pp.168 - 178, 1996-06 |
| Investigation of coating failure on the surface of a water ballast tank of an oil tanker Lee, Dai Gil; Kim, BC, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.19, no.10, pp.879 - 908, 2005 |
| 열응력에 의한 실리콘 인터포저 위 금속 패드의 박락 현상 김준모; 김보연; 정청하; 김구성; 김택수, 마이크로전자 및 패키징학회지, v.29, no.3, pp.25 - 29, 2022-09 |
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