Browse "ME-Journal Papers(저널논문)" by Subject reliability
Showing results 1 to 8 of 8
| A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry Park, Jin-Hyoung; Jang, Kyung-Woon; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.33, no.1, pp.215 - 221, 2010-03 |
| Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics 김산위; 김택수, 마이크로전자 및 패키징학회지, v.19, no.3, pp.63 - 69, 2012-09 |
| Experimental techniques for fatigue reliability of BGA solder bumps in electronic packaging Lee, Soon-Bok; Park, TS; Ham, SJ, JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, v.43, no.4, pp.400 - 407, 2000-10 |
| Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03 |
| Second-order reliability method-based inverse reliability analysis using Hessian update for accurate and efficient reliability-based design optimization Lim, Jong Min; Lee, Byung Chai; Lee, IkJin, INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, v.100, no.10, pp.773 - 792, 2014-12 |
| Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability Ha, Chang-Wan; Kim, Kyung-Rok; Kim, Kyung-Soo; Kim, Soohyun, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.2, pp.205 - 212, 2013-02 |
| Sn3.5Ag와 Sn0.7Cu 무연솔더에 대한 고온 진동 신뢰성 연구 고용호; 김택수; 이영규; 유세훈; 이창우, 마이크로전자 및 패키징학회지, v.19, no.3, pp.31 - 36, 2012-09 |
| Theoretical prediction and experimental measurement of the degree of cure of anisotropic conductive films (ACFs) for chip-on-flex (COF) applications Chung, Chang-Kyu; Kwon, Yong-Min; Kim, Il; Son, Ho-Young; Choo, Kyo-Sung; Kim, Sung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.10, pp.1580 - 1590, 2008-10 |
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