Browse "ME-Journal Papers(저널논문)" by Subject pressure on the interface

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A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks

Lee, H; Earmme, Youn-Young, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, v.19, no.2, pp.168 - 178, 1996-06

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