Showing results 1 to 2 of 2
Effects of the functional groups of nonconductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards Chung, Chang-Kyu; Kwon, Woon-Seong; Jang, Kyung-Woon; Park, Jin-Flyoung; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.30, no.3, pp.464 - 471, 2007 |
Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03 |
Discover