Browse "ME-Journal Papers(저널논문)" by Subject finite element analysis (FEA)
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| Analysis of Asymmetric Warpage of Thin Wafers on Flat Plate Considering Bifurcation and Gravitational Force Shin, Dong Kil; Lee, Jungju, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.2, pp.248 - 258, 2014-02 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
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