Browse "ME-Journal Papers(저널논문)" by Subject curvature
Showing results 1 to 6 of 6
| Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.8, pp.11024 - 11032, 2023-01 |
| Haptic Rendering of 3D Geometry on 2D Touch Surface Based on Mechanical Rotation Kim, Seung-Chan; Han, Byungkil; Kwon, Dong-Soo, IEEE TRANSACTIONS ON HAPTICS, v.11, no.1, pp.140 - 145, 2018-01 |
| Helical extension method for solving the natural equation of a space curve Lim, Sungyeop; Han, Soonhung, SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES, v.5, no.3, 2017-09 |
| Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.32, pp.38750 - 38758, 2023-08 |
| Residual stress-driven test technique for freestanding ultrathin films: Elastic behavior and residual strain Cuddalorepatta, Gayatri K.; Sim, Gi-Dong; Li, Han; Pantuso, Daniel; Vlassak, Joost J., JOURNAL OF MATERIALS RESEARCH, v.34, no.20, pp.3474 - 3482, 2019-10 |
| Segmentation of measured point data using a parametric quadric surface approximation Yang, Min-Yang; Lee, E, COMPUTER-AIDED DESIGN, v.31, no.7, pp.449 - 457, 1999-06 |
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