Browse "ME-Journal Papers(저널논문)" by Subject Twyman-Green interferometry
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| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Measuring and compensating for 5-DOF parasitic motion errors in translation stages using Twyman-Green interferometry Oh, Jeong Seok; Bae, Eun Deok; Keem, Taeho; Kim, Seung-Woo, INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, v.46, no.14, pp.1748 - 1752, 2006-11 |
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