Browse "ME-Journal Papers(저널논문)" by Subject THERMAL RESIDUAL-STRESS
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| Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.8, pp.11024 - 11032, 2023-01 |
| Surface modification of carbon fiber/epoxy composites with randomly oriented aramid fiber felt for adhesion strength enhancement Choi, Ilbeom; Lee, Dai Gil, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.48, pp.1 - 8, 2013-05 |
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