Browse "ME-Journal Papers(저널논문)" by Subject TECHNOLOGY
Showing results 1 to 29 of 29
| A review of wearable sensors and systems with application in rehabilitation Patel, Shyamal; Park, Hyung-Soon; Bonato, Paolo; Chan, Leighton; Rodgers, Mary, JOURNAL OF NEUROENGINEERING AND REHABILITATION, v.9, 2012-04 |
| A review on 3D printed bioimplants Ho, Chee Meng Benjamin; Ng, Sum Huan; Yoon, Yong-Jin, INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, v.16, no.5, pp.1035 - 1046, 2015-05 |
| Advanced Electrochemical Properties of LnBa(0.5)Sr(0.5)Co(2)O(5+delta) (Ln=Pr, Sm, and Gd) as Cathode Materials for IT-SOFC Kim, Jung Hyun; Cassidy, Mark; Irvine, John T. S.; Bae, Joongmyeon, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.6, pp.682 - 689, 2009 |
| Bacterial Nano-Cellulose Triboelectric Nanogenerator Kim, Hyun-Jun; Yim, Eun-Chae; Kim, Jong-Hun; Kim, Seong-Jun; Park, Jeong Young; Oh, Il-Kwon, NANO ENERGY, v.33, no.-, pp.130 - 137, 2017-03 |
| Broadband Modulation of Terahertz Waves With Non-Resonant Graphene Meta-Devices Lee, Seung Hoon; Kim, Hyeon-Don; Choi, Hyun Joo; Kang, Byungsoo; Cho, Yong Rae; Min, Bumki, IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, v.3, no.6, pp.764 - 771, 2013-11 |
| Characterization of calcium carbonate sorbent particle in furnace environment Lee, Kang-Soo; Jung, Jae-Hee; Keel, Sang-In; Yun, Jin-Han; Min, Tai-Jin; Kim, Sang-Soo, SCIENCE OF THE TOTAL ENVIRONMENT, v.429, pp.266 - 271, 2012-07 |
| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Chip warpage model for reliability prediction of delamination failures Yang, Se Young; Kwon, Woon-Seong; Lee, Soon-Bok, MICROELECTRONICS RELIABILITY, v.52, no.4, pp.718 - 724, 2012-04 |
| Design analysis of hybrid silicon-on-nothing photonic crystal-nanoantenna structures for engineering of midinfrared radiative properties Jensen, Devon; Song, Jihwan; Kim, Dongchoul; Lee, Jungchul; Bothun, Geofferey D.; Bose, Arijit; Park, Keunhan, JOURNAL OF NANOPHOTONICS, v.12, no.2, 2018-04 |
| Design of a heat exchanger to reduce the exhaust temperature in a spark-ignition engine Lee, Seokhwan; Bae, Choongsik, INTERNATIONAL JOURNAL OF THERMAL SCIENCES, v.47, no.4, pp.468 - 478, 2008-04 |
| Display process compatible accurate graphene patterning for OLED applications Shin, Jin-Wook; Han, Jun-Han; Cho, Hyunsu; Moon, Jaehyun; Kwon, Byoung-Hwa; Cho, Seungmin; Yoon, Taeshik; et al, 2D Materials, v.5, no.1, 2018-01 |
Dual-detection confocal fluorescence microscopy: fluorescence axial imaging without axial scanning Lee, Dong-Ryoung; Kim, Young-Duk; Gweon, Dae-Gab; Yoo, Hong-Ki, OPTICS EXPRESS, v.21, no.15, pp.17839 - 17848, 2013-07 |
| Effect of CO2 gasification reaction on char particle combustion in oxy-fuel conditions Kim, Dae Hee; Choi, Sangmin; Shaddix, Christopher R.; Geier, Manfred, FUEL, v.120, pp.130 - 140, 2014-03 |
| Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu, MATERIALS CHARACTERIZATION, v.124, pp.250 - 259, 2017-02 |
| Effects of Thickness and Crystallographic Orientation on Tensile Properties of Thinned Silicon Wafers Lee, Sangmin; Kim, Jae-Han; Kim, Young Suk; Ohba, Takayuki; Kim, Taek-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.2, pp.1 - 1, 2020-02 |
| Elastic region of an ACF joint for thermosonic flip-chip bonding Ha, Chang-Wan; Jang, Tae-Young; Kim, Kyung-Rok; Yun, Won-Soo; Kim, Kyung-Soo, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.21, no.9, 2011-09 |
| Enhanced photovoltaic efficiency through radiative cooling augmented by a thermosyphon effect Yoon, Siwon; Seo, Junyong; Choi, Minwoo; Lee, Bong Jae, ENERGY CONVERSION AND MANAGEMENT, v.268, 2022-09 |
| Fabrication of a ZnO piezoelectric micro cantilever with a high-aspect-ratio nano tip Lee, SH; Lee, Seung Seob; Choi, JJ; Jeon, JU; Ro, K, MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, v.11, no.6, pp.416 - 423, 2005-05 |
| Flow boiling heat transfer characteristics of R123 and R134a in a micro-channel Sehwan In; Jeong, Sangkwon, INTERNATIONAL JOURNAL OF MULTIPHASE FLOW, v.35, no.11, pp.987 - 1000, 2009-11 |
| Graph theory approach for match reduction in image mosaicing Elibol, Armagan; Gracias, Nuno; Garcia, Rafael; Kim, Jinwhan, JOURNAL OF THE OPTICAL SOCIETY OF AMERICA A-OPTICS IMAGE SCIENCE AND VISION, v.31, no.4, pp.773 - 782, 2014-04 |
| Heat transfer analysis of a high-power and large-capacity thermal battery and investigation of effective thermal model Jeong, Mun Goung; Cho, Jang-Hyeon; Lee, Bong Jae, JOURNAL OF POWER SOURCES, v.424, pp.35 - 41, 2019-06 |
| Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05 |
| Multi-objective optimization of VOC recovery and reuse in crude oil loading Lee, Sangick; Choi, Inhwan; Chang, Daejun, APPLIED ENERGY, v.108, pp.439 - 447, 2013-08 |
| Polarization Resistances of (Ln(1-x)Sr(x))CoO3 (Ln=Pr, Nd, Sm, and Gd x=0, 0.3, 0.5, 0.7, and 1) as Cathode Materials for Intermediate Temperature-operating Solid Oxide Fuel Cells Kim, Jung Hyun; Baek, Seung-Wook; Bae, Joongmyeon, JOURNAL OF FUEL CELL SCIENCE AND TECHNOLOGY, v.6, no.3, 2009-08 |
| Recent Advances in Ocean Nuclear Power Plants Lee, Kang-Heon; Kim, Min-Gil; Lee, Jeong-Ik; Lee, Phill-Seung, ENERGIES, v.8, no.10, pp.11470 - 11492, 2015-10 |
| Start-up strategy of a diesel reformer using the decomposition heat of hydrogen peroxide for subsea applications Han, Gwangwoo; Bae, Minseok; Cho, Sungbaek; Bae, Joongmyeon, JOURNAL OF POWER SOURCES, v.448, 2020-02 |
| Thermal stability characteristics of high-power, large-capacity, reserve thermal batteries with pure Li and Li(Si) anodes Cho, Jang-Hyeon; Im, Chae Nam; Choi, Chi Hun; Ha, Sang-hyeon; Yoon, Hyun-Ki; Choi, Yusong; Bae, Joongmyeon, ELECTROCHIMICA ACTA, v.353, 2020-09 |
| Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01 |
| Using lateral vibration for thermosonic flip-chip interconnection with anisotropic conductive film Kim, Kyung-Soo; Ha, CW; Jang, TY; Joung, SW; Yun, WS, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.20, no.10, 2010-10 |
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