Showing results 1 to 2 of 2
A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Kim, Youson; Kim, Junmo; kim, chanyoung; Kim, Taehyun; Lee, Chungryeol; Jeong, Kihoon; Jo, Woosung; et al, CHEMICAL ENGINEERING JOURNAL, v.431, no.2, 2022-03 |
유연/신축성 전자패키징 용 폴리머 재료의 기계적 물성 측정 기술 리뷰 김철규; 이태익; 김택수, 마이크로전자 및 패키징학회지, v.23, no.2, pp.19 - 28, 2016-06 |
Discover