Browse "ME-Journal Papers(저널논문)" by Subject Reliability
Showing results 1 to 12 of 12
| A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films Pan, Yan; Oh, Seung-Jin; Kim, Ji-Hye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.6, pp.941 - 948, 2020-06 |
| Accuracy and Reliability of Length Measurements on Three-Dimensional Computed Tomography Using Open-Source OsiriX Software Kim, Gihyeon; Jung, Ho-Joong; Lee, Han-Jun; Lee, Jae-Sung; Koo, Seungbum; Chang, Seung-Hwan, JOURNAL OF DIGITAL IMAGING, v.25, no.4, pp.486 - 491, 2012-08 |
Design of reliability critical system using axiomatic design with FMECA Goo, Bongeun; Lee, Joohee; Seo, Suwon; Chang, Daejun; Chung, Hyun, INTERNATIONAL JOURNAL OF NAVAL ARCHITECTURE AND OCEAN ENGINEERING, v.11, no.1, pp.11 - 21, 2019-01 |
| Elongation improvement of transparent and flexible surface protective coating using polydimethylsiloxane-anchored epoxy-functionalized siloxane hybrid composite for reliable out-foldable displays Lee, Hyunhwan; Lee, Yung; Lee, Sun Woo; Kang, Seung-Mo; Kim, Yun Hyeok; Jo, Woosung; Kim, Taek-Soo; et al, COMPOSITES PART B-ENGINEERING, v.225, 2021-11 |
| Optimization and reliability evaluation of COG bonding process Jeong, Young Hun; Jung, Seung-Won; Jin, Songwan; Kim, Kyung-Soo; Yun, Won-Soo, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.30, no.3, pp.1305 - 1313, 2016-03 |
| Reliability and availability assessment of seabed storage tanks using fault tree analysis Choi, In-Hwan; Chang, Daejun, OCEAN ENGINEERING, v.120, pp.1 - 14, 2016-07 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, J.-W.; Suk, K.-L.; Paik, K.-W.; Lee, Soon-Bok, PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, v.7522, no.0, pp.0 - 0, 2010 |
| Reliability of Modified Ashworth Scale Using a Haptic Robot Finger Simulating Finger Spasticity Ha, D.; Park, Hyung-Soon, Transactions of the Korean Society of Mechanical Engineers, B, v.41, no.2, pp.125 - 133, 2017-02 |
| TSV 기반 3차원 소자의 열적-기계적 신뢰성 윤태식; 김택수, 마이크로전자 및 패키징학회지, v.24, no.1, pp.35 - 43, 2017-03 |
| 그래핀을 이용한 전자패키징 기술 연구 동향 고용호; 최경곤; 김상우; 유동열; 방정환; 김택수, 마이크로전자 및 패키징학회지, v.23, no.2, pp.1 - 10, 2016-06 |
| 크리깅 메타모델과 유전알고리즘을 이용한 신뢰도 계산 및 신뢰도기반 최적설계 조태민; 이병채, 대한기계학회논문집 A, v.33, no.11, pp.1195 - 1201, 2009-11 |
| 플렉시블 전자기기 응용을 위한 미세 솔더 범프 접합부에 관한 연구 고용호; 김민수; 김택수; 방정환; 이창우, 대한용접접합학회지, v.31, no.3, pp.4 - 10, 2013-06 |
Discover
Type
- 12,192 Article
Open Access
- 407 OA Article
Date issued
- 1,610 2020 - 2024
- 3,971 2010 - 2019
- 3,679 2000 - 2009
- 2,269 1990 - 1999
- 600 1980 - 1989