Browse "ME-Journal Papers(저널논문)" by Subject RESINS
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| Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: Prediction and measurement Kwon, Woon-Seong; Yang, Se-Young; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.29, no.3, pp.688 - 695, 2006-09 |
| Ultraviolet surface treatment for adhesion strength improvement of carbon/epoxy composite Kim, JM; Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, pp.1523 - 1542, 2003 |
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