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An In-Process Measurement Technique Using Laser for Non-Contact Monitoring of Surface Roughness and Form Accuracy of Ground Surfaces

Lee, C.S.; Kim, Seung-Woo; Yim, D.Y.; Tönshoff, H.K., CIRP ANNALS - MANUFACTURING TECHNOLOGY, v.36, no.1, pp.425 - 428, 1987

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