Browse "ME-Journal Papers(저널논문)" by Subject Impedance
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| Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by S-Parameter Analysis Kang, Tae Yeob; Seo, Donghwan; Min, Joonki; Kim, Taek-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.6, pp.990 - 998, 2021-06 |
| 입구와 유연한 구조물로 구성된 경계를 가지는 구조-음향 연성계의 수학적 표현 서희선; 김양한, 한국소음진동공학회논문집, v.15, no.5, pp.527 - 535, 2005-05 |
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