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3D Networked Graphene-Ferromagnetic Hybrids for Fast Shape Memory Polymers with Enhanced Mechanical Stiffness and Thermal Conductivity Lee, Sang-Heon; Jung, Jung Hwan; Oh, Il-Kwon, SMALL, v.10, no.19, pp.3880 - 3886, 2014-10 |
Application of the specific thermal properties of Ag nanoparticles to high-resolution metal patterning Son, Yong; Yeo, Jun-Yeob; Ha, Cheol-Woo; Lee, Jin-Hwan; Hong, Suk-Joon; Nam, Koo-Hyun; Yang, Dong-Yol; et al, THERMOCHIMICA ACTA, v.542, pp.52 - 56, 2012-08 |
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee W.S.; Byun K.Y.; Han I.Y.; Kim, SungJin; Yu J., THERMOCHIMICA ACTA, v.455, no.1-2, pp.148 - 155, 2007-04 |
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