Browse "ME-Journal Papers(저널논문)" by Subject Delamination
Showing results 1 to 3 of 3
| Moisture induced interface weakening in ACF package Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12 |
| Processing Challenges and Delamination Prevention Methods in Titanium-Steel DED 3D Printing Andreu, Alberto; Kim, Sanglae; Kim, Insup; Kim, Jeong-Hwan; Noh, Jinhong; Lee, Suhan; Lee, Wonhee; et al, International Journal of Precision Engineering and Manufacturing-Green Technology, 2024-03 |
| Thermally stable and soft pressure-sensitive adhesive for foldable electronics Jo, Woosung; Jeong, Kihoon; Park, Young-Sam; Lee, Jeong-Ik; Im, Sung Gap; Kim, Taek-Soo, CHEMICAL ENGINEERING JOURNAL, v.452, 2023-01 |
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