Browse "ME-Journal Papers(저널논문)" by Subject Cu pillar bump
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| Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07 |
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